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ARA2000 参数 Datasheet PDF下载

ARA2000图片预览
型号: ARA2000
PDF下载: 下载PDF文件 查看货源
内容描述: 地址可编程反向放大器,步进衰减器 [Address-Programmable Reverse Amplifier with Step Attenuator]
分类和应用: 放大器衰减器
文件页数/大小: 20 页 / 204 K
品牌: ANADIGICS [ ANADIGICS, INC ]
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ARA2000  
APPLICATION INFORMATION  
Transmit Enable / Disable  
Amplifier Bias Current  
The ARA2000 includes two amplification stages that  
each can be shut down through external control pins  
Vg1 and Vg2 (pins 6 and 23, respectively.) By  
applying a slightly positive bias of typically +1.0 Volts,  
the amplifier is enabled. In order to disable the  
amplifier, the control pin needs to be pulled to  
ground.  
The ISET pins (7 and 22) set the bias current for the  
amplification stages. Grounding these pins results  
in the maximum possible current. By placing a  
resistor from the pin to ground, the current can be  
reduced. The recommended bias conditions use  
the configuration shown in the test circuit schematic  
in Figure 4.  
A practical way to implement the necessary control  
is to use bias resistor networks similar to those  
shown in the test circuit schematic (Figure 4.) Each  
network includes a resistor shunted to ground that  
serves as a pull-down to disable the amplifier when  
no control voltage is applied. When a positive voltage  
is applied, the network acts as a voltage divider that  
presents the required +1.0 Volts to enable the  
amplifier. By selecting different resistor values for  
the voltage divider, the network can accommodate  
different control voltage inputs.  
Thermal Layout Considerations  
The device package for the ARA2000 features a heat  
slug on the bottom of the package body. Use of the  
heat slug is an integral part of the device design.  
Soldering this slug to the ground plane of the PC  
board will ensure the lowest possible thermal  
resistance for the device, and will result in the longest  
MTF (mean time to failure.)  
A PC board layout that optimizes the benefits of the  
heat slug is shown in Figure 18. The via holes located  
under the body of the device must be plated through  
to a ground plane layer of metal, in order to provide a  
sufficient heat sink. The recommended solder mask  
outline is shown in Figure 19.  
The Vg1 and Vg2 pins may be connected together  
directly, and controlled through a single resistor  
network from a common control voltage.  
Figure 18: PC Board Layout  
Data Sheet - Rev 2.2  
06/2004  
13