AS1543/44
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
VDD to GND/ AGND/ DGND
-0.3
+7
V
VDD +
0.3
VDRIVE to GND/ AGND/ DGND
-0.3
-0.3
-0.3
V
V
V
VDD +
0.3
VINx, REFIN to GND/ AGND/ DGND
CSN, SCLK, DIN,
DOUT to GND/ AGND/ DGND
VDRIVE
+ 0.3
Input Current (any pin except VDD and VINx) -10
θJA Thermal Impedance
+10
30.8
1
mA
ºC/W
kV
Electro-Static Discharge
Operating Temperature Range
Storage Temperature Range
Junction Temperature
-40
-65
+85
+150
+150
ºC
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Package Body Temperature
+260
ºC
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