AS1375
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Input Voltage
Output Short-Circuit Duration
Electrostatic Discharge
Latch-Up
Thermal Resistance
θ
JA
Junction Temperature
Operating Temperature Range
Storage Temperature Range
-40
-65
+140
+150
Indefinite
2
+7
V
V
kV
HBM MIL-Std. 883E 3015.7
methods
ºC/W
ºC
+85
ºC
Internally limited
Package Body Temperature
Te
c
hn
ic a
al m
co s
A
nt G
en
ts
til
+150
ºC
+260
ºC
Revision 1.02
The reflow peak soldering temperature
(body temperature) specified is in
accordance with
IPC/JEDEC J-STD-
020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
lv
3 - 10
100
mA
@85°C, JEDEC 78
al
id
Parameter
Min
Max
Units
Notes
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