AS1363
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
IN, POK, EN, SET/BYP to GND
OUT to GND
Output Short-Circuit Duration
Continuous Power Dissipation
Operating Temperature Range
Storage Temperature Range
Junction Temperature
-40
-65
Min
-0.3
-0.3
Max
+6
V
IN
+0.3
1
800
+85
+150
+150
Units
V
V
min
mW
ºC
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
T
AMB
= +70ºC; derate 10mW/ºC above +70ºC
Comments
Package Body Temperature
+260
ºC
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