AS1361/AS1362
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
IN to GND
OUT, SHDNN, POK to GND
BYPASS to GND
Output Short-Circuit Duration
Thermal Resistance
Θ
JA
Operating Temperature Range
Junction Temperature
Storage Temperature Range
-65
-40
Min
-0.3
-0.3
-0.3
Max
+7
IN +
0.3
OUT +
0.3
Infinite
201.7
+85
+150
+150
ºC/W
ºC
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
on PCB
Units
V
V
V
Comments
Package Body Temperature
+260
ºC
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