AS1360
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
Input Voltage
Continuous Output Current
Peak Output Current
Output Voltage
Electrostatic Discharge
Electrostatic Discharge HBM
Thermal Information
Thermal Resistance
Θ
JA
+/- 1
kV
- 0.3V
+30
PD/
(V
IN
- V
OUT
)
500
V
IN
+ 0.3V
or +7V
V
mA
mA
V
Min
Max
Units
Comments
Minimum of the two values
Temperature Ranges and Storage Conditions
Storage Temperature Range
Package Body Temperature
Humidity non-condensing
Moisture Sensitive Level
Te
c
hn
ic a
al m
co s
A
nt G
en
ts
til
230
ºC/W
ºC
Typical FR4, 4-layer application
-40
+125
+260
ºC
5
85
%
1
Revision 1.07
Norm: MIL 883 E method 3015
The reflow peak soldering temperature (body
temperature) specified is in compliance with
IPC/
JEDEC J-STD-020 “Moisture/ Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
Represents a max. floor life time of unlimited
lv
3 - 13
al
id
AMSCO [ AUSTRIAMICROSYSTEMS AG ]
