AS1340
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
VCC, FB, EN to GND
SWVIN, SWOUT to GND
LX to GND
Min
Max
7
Units
Comments
7
V
55
Thermal Resistance ΘJA
ESD
36.7
1.5
ºC/W
kV
on PCB
HBM MIL-Std. 883E 3015.7 methods
JEDEC 78
Latch-Up
-100
-40
+100
+85
mA
ºC
Operating Temperature Range
Storage Temperature Range
Junction Temperature
-65
+150
125
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Package Body Temperature
+260
ºC
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