AS1331
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
SW1, SW2, VIN, VOUT, EN
PGND to GND
SW1, SW2
ESD
Thermal Resistance
θ
JA
Junction Temperature
Operating Temperature Range
Storage Temperature Range
-0.3
-0.3
-0.3
4
+33
+150
-40
+7
+0.3
+7
V
V
V
kV
ºC/W
ºC
Package Body Temperature
Te
c
hn
ic a
al m
co s
A
nt G
en
ts
til
85
ºC
-65
+125
ºC
+260
ºC
Revision 1.04
The reflow peak soldering temperature
(body temperature) specified is in
accordance with
IPC/JEDEC J-STD-
020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
lv
HBM MIL-Std. 883E 3015.7
methods
al
3 - 16
id
Parameter
Min
Max
Units
Notes
AMSCO [ AUSTRIAMICROSYSTEMS AG ]
