AS1330
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
All Pins to GND
Input Current (latch-up immunity)
Electrostatic Discharge
Human Body Model
Temperature Ranges and Storage Conditions
Junction Temperature
Storage Temperature Range
-55
+150
+150
ºC
ºC
2
kV
-0.3
-100
5
100
V
mA
Norm: JEDEC 78
Min
Max
Units
Notes
Te
c
hn
ic a
al m
co s
A
nt G
en
ts
til
Package Body Temperature
+260
ºC
Humidity non-condensing
Moisture Sensitive Level
5
85
%
1
Revision 1.06
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Represents a max. floor life time of unlimited
lv
3 - 17
Norm: MIL 883 E method 3015
al
id
AMSCO [ AUSTRIAMICROSYSTEMS AG ]
