AS1324
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
VIN to GND
-0.3
7
V
VIN
+ 0.3
SW, EN, FB to GND
-0.3
V
Thermal Resistance ΘJA
ESD
207.4
ºC/W
kV
on PCB
HBM MIL-Std. 883E 3015.7 methods
JEDEC 78
2
Latch-Up
-100
-40
+100
+85
mA
ºC
Operating Temperature Range
Storage Temperature Range
-65
+125
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages
is matte tin (100% Sn).
Package Body Temperature
Junction Temperature
+260
125
ºC
ºC
Junction temperature (TJ) is calculated from
the ambient temperature (TAMB) and power
dissipation (PD) as:
TJ = TAMB + (PD)(207.4ºC/W)
(EQ 1)
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