AS1326
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
ON, ONN, OUT, CLK/SEL to GND
PGND to GND
REF, FB, ISET, POUT to GND
LX to PGND
POUT to OUT
Thermal Resistance
Θ
JA
Operating Temperature Range
Storage Temperature Range
Junction Temperature
-40
-65
Min
-0.3
-0.3
-0.3
-0.3
-0.3
Max
7
+0.3
V
OUT
+
0.3
V
POUT
+
0.3
+0.3
33
+85
+150
+150
Units
V
V
V
V
V
ºC/W
ºC
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
on PCB
Comments
Package Body Temperature
+260
ºC
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