AS1320
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
All Pins to GND
LX Current
Latch-Up
Package Power Dissipation
(T
AMB
= +70ºC)
Operating Temperature Range
Electrostatic Discharge
Humidity (Non-Condensing)
Storage Temperature Range
Junction Temperature
-40
-500
5
-55
-100
Min
-0.3
Max
7
1
100
500
+85
+500
85
125
150
Units
V
A
mA
mW
ºC
V
%
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in compliance with
IPC/JEDEC J-STD-020C “Moisture/ Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
HBM MIL-Std. 883E 3015.7
methods
JEDEC 78
(
Θ
JA
= 9.1mW/ºC above +70ºC)
Comments
Package Body Temperature
260
ºC
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