AS1153/55
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sec-
tions of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
VCC to GND
Min
-0.3
-0.3
-0.3
Max
+5.0
Units
V
Notes
INx+, INx- to GND
+5.0
V
OUTx to GND
VCC + 0.3
128
V
Thermal Resistance ΘJA
Storage Temperature Range
Maximum Junction Temperature
Operating Temperature Range
ºC/W
ºC
Typical 4-layer application
-65
-40
+150
+150
+85
ºC
ºC
The reflow peak soldering
temperature (body temperature)
specified is in compliance with
IPC/JEDEC J-STD-020C
“Moisture/ Reflow Sensitivity
Classification for Non-Hermetic
Solid State Surface Mount
Devices”.
Package Body Temperature
ESD Protection
+260
+4
ºC
kV
-4
Human Body Model, INx+, INx-
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