AS1119
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
VDD to GND
All other pins to GND
Sink Current
Segment Current
Input Current (latch-up immunity)
Electrostatic Discharge
Electrostatic Discharge HBM
Junction Temperature
1.5
kV
ºC
Temperature Ranges and Storage Conditions
Storage Temperature Range
-100
-0.3
-0.3
7
7 or
V
DD
+ 0.3
500
100
100
V
V
mA
mA
mA
Min
Max
Units
Comments
Norm: JEDEC 78
Te
c
hn
ic a
al m
co s
A
nt G
en
ts
til
+125
-55
+125
ºC
Package Body Temperature
+260
85
ºC
Humidity non-condensing
Moisture Sensitive Level
5
%
1
Revision 1.04
Norm: MIL 883 E method 3015
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
Represents a max. floor life time of unlimited
lv
4 - 30
al
id
AMSCO [ AUSTRIAMICROSYSTEMS AG ]
