AS1109
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
VDD to GND
0
7
V
VDD
Input Voltage
-0.4
-0.4
V
+0.4
Output Voltage
15
V
GND Pin Current
1000
mA
83
113
32
ºC/W
ºC/W
on PCB, 16-pin SOIC-150 package
on PCB, 16-pin SSOP-150 package
Thermal Resistance ΘJA
ºC/W on PCB, 16-pin QFN (4x4mm) package
Device fully functional up to 125°C
Operating Temperature Range
Storage Temperature
Humidity
-40
-55
5
+85
150
ºC
ºC
%
86
Non-condensing
Digital Outputs
Electrostatic
2000
2000
Norm: MIL 833 E method 3015
V
Discharge
All Other Pins
+100 +
INOM
-100 -
(INOM x 0.5)
Latch-Up Immunity
mA
EIA/JESD78
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-
020C “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
Package Body Temperature
+260
ºC
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
* Min/max values are load dependent.
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