AS1109
Data Sheet - Detailed Description
Detailed Error Reports
The detailed error report can be read out after global error mode has been run. On the falling edge of LD, the detailed
error report of the selected test is latched into the shift register and can be clocked out with n*8 clock cycles (n is the
number of AS1109s in a chain) via pin SDO. At the same time new data can be written into the shift register, which will
load on the next rising edge of pin LD. This data will show at the output drivers, at the falling edge of OEN.
Detailed Temperature Warning Report
The detailed temperature warning report can be read out immediately after global error mode has been run. Bit0 of the
8bit data word represents the temperature flag of the chip.
Figure 15. Detailed Temperature Warning Report Timing Diagram
Global Flag Readout
Detailed Error Report Readout
OEN
tH(L)
tGSW(ERROR)
t(SU)ERROR
LD
tP4
CLK
Don’t
Care
DBit7
DBit6 DBit5 DBit4 DBit3 DBit2
New Data Input
DBit1 DBit0
SDI
Don’t
Care
TFLAG
TBit0
SDO
Undefined
Temperature Error Report Output
tP4
tP1
For detailed timing information see Timing Diagrams on page 9.
Detailed Temperature Warning Report Example
Consider a case where five AS1109s are cascaded in one chain. The detailed error report lists the temperatures for
each device in the chain:
IC1:[70°] IC2:[85°] IC3:[66°] IC4:[160°] IC5:[76°]
In this case, IC4 is overheated and will generate a global error, and therefore 5*8 clock cycles are needed to write out
the detailed temperature warning report, and optionally read in new data. The detailed temperature warning report
would look like this:
XXXXXXX1 XXXXXXX1 XXXXXXX1 XXXXXXX0 XXXXXXX1
The 0 in the detailed temperature warning report indicates that IC4 is the device with the over-temperature condition.
Note: In an actual report there are no spaces in the output.
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