AS1108
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
Min
Max
Units
Notes
VDD to GND
-0.3
-0.3
7
V
V
VDD + 0.3
(max 7V)
All other pins to GND
Current
DIG 0:DIG 3 Sink Current
SEG A:SEG G, SEG DP
500
100
mA
mA
All pins except AS1108 pin 11: ±180 mA
Norm: JEDEC 78
Latch-Up Immunity
±200
mA
Electrostatic Discharge
Digital outputs
1000
1000
V
V
Norm: MIL 883 E method 3015
All other pins
Continuous Power Dissipation (TA = +85°C)
Derate 11.8mW/ºC
above +70ºC
Wide SOIC
941
mW
ºC
Temperature Ranges and Storage Conditions
Storage Temperature Range
-55
+150
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
Package Body Temperature (Wide SOIC)
+260
85
ºC
%
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity
5
Non-condensing
3
Represents a max. floor life time of 168h
Moisture Sensitive Level
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