data sheet
fcCSP
fcBGA
(Flip Chip BGA):
Moderate routing density, lowest cost flip chip package in intermediate ball
counts. Bare die or Single Piece Lid. Qualified with both BU and 4L thin core
substrates. Ball Count range is 256 - 1900 and Body Size range is 17 - 45 mm.
Ceramic
fcBGA
(Ceramic Flip Chip BGA):
Alumina or HiTCE flip chip packages with BGA, LGA, or SCI interconnect format.
Capability for high layer count enables most flexible format for different ground
and power planes. Available in bare die, AISiC Lid, or low cost Flat Lid.
Qualified in body sizes ti 45 mm HiTCE (BGA), 45 mm alumina (SCI) and 31
mm alumina (BGA).
Applications:
The fcCSP package is targeted to high-performance workstations, servers, data
communication products, internet routers and at high frequency and RF
packaging applications where electrical performance is critical. The elimination of
wirebond loops allows for a low inductance connection to the die, while the
increased routing density enables optimized electrical paths for critical high
frequency signal lines. The fcCSP is also an attractive option for portable and
handheld electronics where, in addition to performance, package size is critical.
LAMINATE
Process Highlights
Die size (max)
Pkg size - 1 mm
Bump pitch (min)
Pkg size - 1 mm
In-line
150
µm
Minimum array
250
µm
Standard Materials
Package substrate
Hitachi FR5 E679 / BT
Bump
63/37 Sn/Pb
Encapsulant
Epoxy mold compound
Solder balls
Eutectic SnPb
Test Services
• Program generation/conversion
• Product engineering
• Wafer sort
• -55 °C to +165 °C test available
• Burn-in
Shipping
JEDEC trays
Tape and reel services
Configuration Options:
Package Offering (units in mm)
Cross-section
fcCSP
Body Size
8x8
9x9
10 x 10
11 x 11
12 x 12
13 x 13
14 x 14
15 x 15
6x6
7x7
8x8
8x8
9x9
10 x 10
11 x 11
12 x 12
3x3
4x4
5x5
5x5
6x6
6x6
7x7
7x7
8x8
8x8
9x9
10 x 10
Pitch
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
Ball Count
49
64
81
100
121
144
169
196
49
64
64
81
100
144
169
196
25
36
48
64
64
84
80
108
96
132
156
180
Matrix
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
2 Row
Full
2 Row
3 Row
2 Row
3 Row
2 Row
3 Row
3 Row
3 Row
Ceramic
fcBGA
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
AMKOR [ AMKOR TECHNOLOGY ]
