data sheet
fcCSP
Features:
LAMINATE
fcCSP
Packages:
Amkor Technology is now offering the Flip Chip CSP
(fcCSP) package — a flip chip solution in a CSP
package format. This package construction utilizes
eutectic tin/lead (63Sn/37Pb) flip chip interconnect
technology, in either area array or peripheral bump
layout, replacing standard wirebond interconnect. The
advantages of flip chip interconnect are twofold: it
provides enhanced electrical performance over
standard wirebond technology, and it allows for a
smaller form factor due to increased routing density,
the ability to use area array die bumps and the
elimination of wirebond loops. Current wafer bump
technology and flip chip assembly process allows for a
minimum of 150
µm
peripheral flip chip bumping, or
250
µm
area array bumping.
The
fcCSP
is based on Amkor's proprietary
ChipArray
®
BGA (CABGA) package construction,
using cutting edge thin core laminate substrates.
The package is assembled in strip format, gang
molded and saw singulated for manufacturing
efficiency and cost minimization. Laser ablated solder
mask technology, via-in-pad substrate structure, and
thin core substrate panel processing allow for
increased routing density and enhanced electrical
performance, making the
fcCSP
an attractive option
for advanced CSP applications where electrical
performance is a critical factor.
The
fcCSP
is available in both thin core laminate
substrate technology, as well as ceramic substrate
technology. Package size ranges from 3 mm to 15
mm, accommodating BGA ball pitches from 0.5 mm
to 1.0 mm. In addition to BGA technology, the
fcCSP
is also available in LGA format, allowing for a lower
minimum package thickness.
The Ceramic flip chip package provides maximum
flexibility for designers for number of layers and
routing. Current production is from 300 - 1800 I/O
in LGA, BGA or SCI (solder column interposer)
formats, 1.27 mm and 1.0 mm pitch. AlSiC lids
can be attached for maximum thermal dissipation.
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Designed for high frequency applications
49 - 1800 ball counts
Target Market - Cell Phones, Hand-held Electronics
Thin core laminate or ceramic package construction
Overmolded for handling and second level reliability
Accommodates package sizes from 3 mm to 15 mm
Flip Chip bump pitches of 150
µ
m min. for
peripheral array, 250
µ
m min. for area array
Available in 0.5 mm - 1.0 mm BGA ball pitch,
as well as LGA interconnect
Minimum nominal package thickness of 0.80 mm for
LGA interconnect, 1.0 mm for 0.5 mm BGA pitch,
1.2 mm for 0.8 mm pitch
Turnkey Solution - Design, bumping, bumped wafer
probe, backgrind, assembly, test
Much better signal to noise ratio at higher
frequencies (>1Ghz)
Low inductance of flip chip bumps - short, direct
signal path
Flexible customized substrate routing
Thermal Performance:
Theta JA (°CW)
• 8 x 8 mm, 64 lead package with
1.75 mm x 2.27 mm die, 0.8 mm pitch,
0.6 mm mold cap
• 0 LFPM, 4 layer PC board
• Junction ambient thermal resistance = 48.1 °C/W
8 x 8 mm body, 64 ld, 0.8 mm ball pitch
Max
Min
0.26 nH
2.16 nH
Inductance
Capacitance
0.18 pF
0.38 pF
7 mΩ
53.9 mΩ
Resistance
Simulated results @ at 100 MHz
Electrical:
Reliability:
Package Level:
• Laminate Moisture
Sensitivity
• Ceramic Moisture
Sensitivity
• PCT
• Temp/Humidity
• High temp storage
• Temp cycle
Board Level:
• Thermal cycle
• Thermal cycle
JEDEC Level 3 @ 240 °C
30 °C/60% RH, 192 hours
JEDEC Level 1 @ 260 °C
85 °C/85% RH, 168 hours
121 °C/100% RH, 96 hours
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
-55 °C/+125 °C, 1000 cycles
-40 °C/+125 °C,
1 cycle/hour, 3000 cycles*
-40 °C/+125 °C,
2 cycles/hour, 2500 cycles*
*Data for 8 x 8 mm body, 64 lead, 0.33 mm PWB NSMD pad size
www.amkor.com
DS577D
Rev Date: 07’05
AMKOR [ AMKOR TECHNOLOGY ]
