LP61L1024
Package Information
36LD CSP (6 x 8 mm) Outline Dimensions
unit: mm
TOP VIEW
BOTTOM VIEW
Ball#A1 CORNER
S
0.10
C
S
0.25 C A B
Ball*A1 CORNER
b (36X)
6
5 4 3 2 1
1
2 3 4 5 6
A
B
C
D
E
F
A
B
C
D
E
F
G
H
G
H
B
e
D1
A
SIDE VIEW
D
0.20(4X)
C
SEATING PLANE
Dimensions in mm
Symbol
MIN. NOM. MAX.
A
A1
A2
D
1.00
0.16
0.48
5.80
7.80
---
1.10
0.21
0.53
6.00
8.00
3.75
5.25
0.75
0.30
1.20
0.26
0.58
6.20
8.20
---
E
D1
E1
e
---
---
---
---
b
0.25
0.35
Note:
1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).
2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM.
4. THEERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF
THE SOLDER BALL AND THE BODY EDGE.
(August, 2002, Version 2.1)
15
AMIC Technology, Inc.
AMICC [ AMIC TECHNOLOGY ]
