Data Sheet
AMIS-30663
High Speed CAN Transceiver
Table 8: Soldering Process
Soldering Method
Package
Wave
Reflow (1)
Suitable
BGA, SQFP
Not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS Not suitable (2)
Suitable
PLCC (3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Suitable
Suitable
Not recommended (3)(4) Suitable
Not recommended (5) Suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package,
there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information
in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods."
2. These packages are not suitable for wave soldering as a solder joint between the printed circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick
to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream
and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or
smaller than 0.65mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or
smaller than 0.5mm.
AMI Semiconductor - Rev. 1.4, Oct. 04
12
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