Data Sheet
AMIS-30663
High Speed CAN Transceiver
9.0 Package Outline
SOIC-8: Plastic small outline; 8 leads; body width 150 mil; JEDEC: MS-012
Common Dimensions
Symbol
A
Note
Min.
.061
Nom.
.064
Max.
.068
NOTES:
1
A
.004
.006
0.010
1. Maximum die thickness allowable is .015.
2. Dimensioning and tolerances per ANSI.Y14.5M - 1982.
3. “L” is the length of terminal for soldering to a substrate.
4. “N” is the number of terminal positions.
5. Formed leads shall be planar with respect to one another
within .003 inches at seating plane.
6. Country of origin location and ejector pin on package
bottom is optional and depend on assembly location.
7. Controlling dimension: inches.
2
A
.055
.0138
.0075
.058
.061
.008
.061
.020
.0098
B
C
D
E
e
H
h
L
N
α°
See Variations
.155
.050 BSC
.236
.013
.025
See Variations
5°
1
2
.150
.157
.230
.010
.016
.244
.016
.035
0°
8°
Variations
1
2
D
N
Note
AA
AB
Min.
.189
.337
.386
Nom.
.194
.342
Max.
.196
.344
.393
8
14
16
AC
.391
AMI Semiconductor - Rev. 1.4, Oct. 04
www.amis.com
10
AMI [ AMI SEMICONDUCTOR ]
