AMIS-30623 LIN Microstepping Motordriver
Data Sheet
Notes:
(1) All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to
the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
(2) These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder
may stick to the heatsink (on top version).
(3) If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves
downstream and at the side corners.
(4) Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.65mm.
(5) Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.5mm.
21.0 Company or Product Inquiries
For more information about AMI Semiconductor, our technology and our product, visit our Web site at: http://www.amis.com.
North America
Tel: +1.208.233.4690
Fax : +1.208.234.6795
Europe
Tel : +32 (0) 55.33.22.11
Fax : +32 (0) 55.31.81.12
22.0 Document History
Table 40: Document history
Version
1.0
2.1
Date of Version
July 16, 2002
Modifications/Additions
First non-preliminary issue
Complete review
December 5th , 2005
June 19, 2006
3.0
Public release
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS
makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any
time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range,
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not
recommended without additional processing by AMIS for such applications. Copyright ©2006 AMI Semiconductor, Inc.
AMI Semiconductor – June 2006, Rev 3.0
67
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