AMIS-30621 LIN Micro-stepping Motor Driver
Data Sheet
Table 29: Soldering Process
Soldering Method
Package
Wave
Re-flow (1)
Suitable
Suitable
Suitable
Suitable
Suitable
BGA, SQFP
Not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
Not suitable (2)
Suitable
LQFP, QFP, TQFP
Not recommended (3)(4)
Not recommended (5)
SSOP, TSSOP, VSO
Notes:
(1) All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to
the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
(2) These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder
may stick to the heatsink (on top version).
(3) If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves
downstream and at the side corners.
(4) Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.65mm.
(5) Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.5mm.
20.0 Company or Product Inquiries
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21.0 Document History
Table 30: Document history
Version
1.4
Date of Version
March 3, 2003
Modifications/Additions
First non-preliminary version for public release
1.5
September 6, 2007
Various cosmetic changes, addition of detailed feature descriptions and U-product options.
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