AME
300mA CMOS LDO with
RESET Function
AME1300
n Package Dimension
MSOP-8
MILLIMETERS
INCHES
MIN
SYMBOLS
MIN
-
MAX
1.07
0.20
0.92
0.38
0.33
0.23
0.17
3.10
4.98
3.10
MAX
0.04197
0.008
0.036
0.015
0.013
0.009
0.006
0.122
0.196
0.122
Top View
DETAIL A
A
A1
A2
b
-
D
e1
0.05
0.81
0.28
0.28
0.13
0.13
2.90
4.77
2.90
0.002
0.032
0.011
0.011
0.005
0.005
0.114
0.188
0.114
TOP PKG.
BTM PKG.
b1
c
θ
E1
E
L2
L
L1
c1
D
PIN 1 I.D
(SHINNY SURFACE)
E
E1
e
0.65 TYP
1.95 TYP
0.406 0.686 0.01598 0.02701
0.94 REF
0.254 TYP
0o 8o
0.0255 TYP
0.0767 TYP
e1
L
R0.127(0.005) TYP
ALL CORNER
& EDGES
Front View
0.037 REF
0.010 TYP
L1
L2
A2
A
0o
8o
A1
q
e
NOTE:
b
1. Controlling dimension : Millimeter, converted inchdimension
are not necessarily exact.
2. Dimensiioning and tolerancing per ansi Y14.5m-1994.
3. Dimension "d" does not include mold flash,protrusion or gate
burr, mold flash,protrusion and gate burr shall not exceed
0.15mm(0.006") per side. Dimension e1 do not include inter-lead
flash or protrusion, inter-lead flash and protrusion shall not ex-
ceed 0.15mm(0.006") per side.
4. The package top be smaller than the package bottom. Dimen-
sion d and e1 are determined at outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
End View
SECTION B-B
b
BASE METAL
b1
B
c
c1
B
E1
WITH PLATING
See Detail A
5. Dimension 'b' does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm(0.0031) total in excess of
the "b" dimension at maximum material condition.
Rev.C.02
11
AME [ ANALOG MICROELECTRONICS ]
