TYPICAL THERMAL CHARACTERISTICS
Measured at 25°C ambient. These parameters are not tested.
Typ
Parameter
Symbol
Parameter Description
Thermal impedance, junction to case
TQFP
11.3
41
PLCC
4
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
θ
θ
jc
ja
Thermal impedance, junction to ambient
30.4
18.5
15.9
13.5
12.8
200 lfpm air
400 lfpm air
600 lfpm air
800 lfpm air
35
33.7
32.6
32
Thermal impedance, junction to ambient
with air flow
θ
jma
Plastic θ Considerations
jc
The data listed for plastic θ are for reference only and are not recommended for use in calculating junction temperatures. The
jc
heat-flow paths in plastic-encapsulated devices are complex, making the θ measurement relative to a specific location on the
jc
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of
the package. Furthermore, θ tests on packages are performed in a constant-temperature bath, keeping the package surface at
jc
a constant temperature. Therefore, the measurements can only be used in a similar environment. TQFP thermal measurements
are taken with components on a six-layer printed circuit board.
MACH211SP-7/10/12/15/20
23
AMD [ AMD ]
