D A T A S H E E T
REVISION SUMMARY
Ordering Information
Revision A (January 1999)
Added dash to OPN.
The Am29LV160D is fully form, fit, and function com-
patible with the Am29LV160B device, with the
following differences:
Revision B+2 (November 7, 2000)
Global
A 70 ns device at full voltage range is now available.
The 80 ns speed option has been deleted.
Deleted Preliminary status from data sheet. Deleted
burn-in option. Added table of contents.
Byte and word programming times, and byte- and
word-mode chip programming times are now reduced.
Revision B+3 (November 10, 2000)
Command Definitions
At extended temperatures (>+85°C), sleep and
standby currents increase.
Reset Command: Deleted reference to Figure 14, RE-
SET# Timings, which applies only to hardware reset.
Revision A+1 (April 19, 1999)
Global
Revision B+4 (April 5, 2004)
Erase/Program Operations
Reclassified the document from advance information
to preliminary.
Changed standard parameter t
from Min to Max.
BUSY
The 70 ns speed option is now also available with the
industrial and extended temperature range ratings.
Revision B+5 (June 4, 2004)
Ordering Information
Revision B (November 23, 1999)
Added Pb-Free OPNs.
AC Characteristics—Figure 17. Program
Operations Timing and Figure 18. Chip/Sector
Erase Operations
Revision B+6 (October 7, 2004)
Cover Sheet and Title Page
Deleted t
high.
and changed OE# waveform to start at
GHWL
Added notation to superseding document.
Physical Dimensions
Revision B7 (May 5, 2006)
Updated migration and obsolescence statement on
cover page and first page of data sheet.
Replaced figures with more detailed illustrations.
Revision B+1 (February 22, 2000)
Global
Updated trademarks.
Added dash to speed options.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-
vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-
sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 1999–2006 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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Am29LV160D
May 5, 2006 22358B7
AMD [ AMD ]
