SONET/SDH CLOCK RECOVERY UNIT
Figure 6. 32 TQFP Package
S3040B
TOP VIEW
CONNECTED
TO VEE
BOTTOM VIEW
Note: The S3040 package is equipped with an embedded conductive heatsink on the bottom (board side). Active circuitry and vias should not
appear in the area immediately under the package. This heatsink is electrically biased to the VEE potential of the S3040. For optimum thermal
management, a foil surface at ground (or VEE if other than ground) is recommended immediately under the package, and connected with
multiple vias to the internal plane(s) of similar potential. Thermally conductive epoxy or other conductive interposer can be used to establish a
good thermal dissipation path.
Thermal Management
Device
S3040
Θ
ja
36˚ C/W with heatsink
soldered to ground plane
Θ
jc
2˚ C/W
April 6, 2000 / Revision NC
7
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
