32 x 32 1.5 GBIT/S DIFFERENTIAL CROSSPOINT SWITCH
S2025
Figure 5. 196-Pin LDCC Package
TOP
148
147
196
1
.105 ±.010
1.350 ±.010
TOP VIEW
99
98
49
50
.290 min
.055 ± .010
COPLANAR TO .004
.045 ± .005
1.550
± .015
.008 ± .002
.025 ± .002
Non-conductive Tie-bar*
All dimensions nominal in inches.
* Trim non-conductive tie-bar prior to board attachment
Thermal Management
Symbol
Θjc
Description
Thermal resistance from junction to case
Thermal resistance from junction to ambient
Airflow
Value
Units
oC/W
oC/W
2.3
Θja
Still air
25.6
800
LFPM
oC/W
Θja
Thermal resistance from junction to ambient with heatsink
3.53
Note: S2025 requires an AMCC heatsink 45-17 with an airflow of 800 LFPM for operation over commercial temperatures.
10
June 24, 1999 / Revision B
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
