Revision 1.15 – August 30, 2007
440GX – Power PC 440GX Embedded Processor
Data Sheet
Recommended DC Operating Conditions (Continued)
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended
conditions can affect device reliability.
Parameter
Symbol
Minimum
Typical
Maximum
Unit
V
Notes
VOMAO
Output Max Allowable Overshoot (3.3V LVTTL)
Output Max Allowable Undershoot (3.3V LVTTL)
Case Temperature rating for C package and S package
Case Temperature rating E for C package
Case Temperature rating E for F package
Notes:
+3.9
VOMAU3
TC
-0.6
-40
-40
-40
V
+85
+105
+100
°C
°C
°C
6
6
6
TC
TC
1. PCI-X drivers meet PCI-X specifications.
2. SVREF = SVDD/2
3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the
PPC440GX. See “Absolute Maximum Ratings” on page 58.
4. During chip power-up, OVDD should begin to ramp before VDD. External voltage should not be applied to the chip I/O pins before
OVDD is applied to the chip. A power-down cycle should complete (OVDD and VDD should both be below 0.4V) before a new power-
up cycle is started.
5. LPDL is least positive down level; MPUL is most positive up level.
6. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
Input Capacitance
Parameter
Symbol
Maximum
Unit
pF
Notes
CIN1
Group 1 (2.5V SSTL I/O)
Group 2 (3.3V LVTTL I/O)
Group 3 (PCI-X I/O)
12
12
12
9
CIN2
CIN3
CIN4
CIN5
pF
pF
Group 4 (Receivers)
pF
Group 5 (3.3V tolerant CMOS I/O)
16
pF
62
AMCC
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
