Revision 1.07 – October 4, 2007
440GP – Power PC 440GP Embedded Processor
Data Sheet
Recommended DC Operating Conditions (Continued)
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended
conditions can affect device reliability.
Parameter
Case Temperature rating for C package
Case Temperature rating E for C package
Case Temperature rating E for F package
Notes:
Symbol
Minimum
-40
Typical
Maximum
+85
Unit
°C
Notes
TC
6
6
6
TC
TC
-40
+105
°C
-40
+100
°C
1. PCI-X drivers meet PCI-X specifications.
2. SVREF = SVDD/2
3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the
PPC440GP. See “Absolute Maximum Ratings” on page 55.
4. During chip power-up, OVDD should begin to ramp before VDD. External voltage should not be applied to the chip I/O pins before
OVDD is applied to the chip. A power-down cycle should complete (OVDD and VDD should both be below 0.4V) before a new power-
up cycle is started.
5. LPDL is least positive down level; MPUL is most positive up level.
6. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
Input Capacitance
Parameter
Symbol
Maximum
Unit
pF
Notes
CIN1
Group 1 (2.5V SSTL I/O)
12
12
12
9
CIN2
CIN3
CIN4
Group 2 (5V tolerant LVTTL I/O)
Group 3 (PCI-X I/O)
pF
pF
Group 4 (Receivers)
pF
DC Power Supply Loads
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Notes
V
DD (1.8V) active operating current
IDD
915
125
560
33
mA
mA
mA
mA
2
2
OVDD (3.3V) active operating current
SVDD (2.5V) active operating current
AxVDD (1.8V) input current
Notes:
IODD
ISDD
IADD
2
1, 2
1. See “Absolute Maximum Ratings” on page 55 for filter recommendations.
2. The current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors including
the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature, and the
power supply voltages. Your specific application can produce significantly different results. VDD (logic) current and power are primarily
dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD (I/O) current and
power are primarily dependent on the capacitive loading, frequency, and utilization of the external buses.
AMCC
59
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
