Revision 1.25 – December 18, 2006
440EP – PPC440EP Embedded Processor
Data Sheet
Table 12. DC Power Supply Current Loads
Parameter
Symbol
Typical
1380
10
Maximum
Unit
mA
mA
mA
mA
mA
Notes
V
DD (1.5V) active operating current
IDD
2200
100
600
5
OVDD (3.3V) active operating current
SVDD (2.5V) active operating current
AVDD (1.5V) input current
IODD
ISDD
460
IADD
3.2
1
1
SAVDD (1.5V) active operating current
ISADD
6.05
10
Notes:
1. See “Absolute Maximum Ratings” on page 60 for filter recommendations.
2. The maximum current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors
including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature,
and the power supply voltages. Your specific application can produce significantly different results. VDD current and power are primarily
dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD current and power
are primarily dependent on the capacitive loading, frequency, and utilization of the external buses.
3. Typical current is estimated at 667MHz with VDD = +1.5V, OVDD = +3.3V, SVDD = +2.5V, and TC = +85°C, while running Linux and a test
application that exercises each core with representative traffic.
4. Maximum current is estimated at 667MHz with VDD = +1.6V, OVDD = +3.6V, SVDD = +2.7V, TC = +85°C, and a best-case process (which
drives worst-case power), while running Linux and a test application that exercises each core with representative traffic.
Table 13. Package Thermal Specifications
Thermal resistance values for the E-PBGA and TE-PBGA package are as follows:
Airflow
ft/min (m/sec)
Parameter
Symbol
Package
Unit
Notes
0 (0)
20.0
15.6
15.3
13.9
100 (0.51)
200 (1.02)
17.9
E-PBGA
TE-PBGA
E-PBGA
18.7
°C/W
°C/W
°C/W
°C/W
Junction-to-ambient thermal resistance
without heat sink
θJA
θJA
13.6
12.8
11.9
10.5
Junction-to-ambient thermal resistance
with heat sink
TE-PBGA
10.4
9.0
Resistance Value
E-PBGA
TE-PBGA
E-PBGA
8.3
6.3
°C/W
°C/W
°C/W
°C/W
Junction-to-case thermal resistance
θJC
θJB
14.3
9.3
Junction-to-board thermal resistance
TE-PBGA
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
2. TA = TC - P×θCA, where TA is ambient temperature and P is power consumption.
3. TCMax = TJMax - P×θJC, where TJMax is maximum junction temperature (+125°C) and P is power consumption.
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved with a JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
AMCC Proprietary
63
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
