Revision 1.29 – May 07, 2008
440EP – PPC440EP Embedded Processor
Data Sheet
Table 16. Package Thermal Specifications
Thermal resistance values for the E-PBGA and TE-PBGA package are as follows:
Airflow
ft/min (m/sec)
Parameter
Symbol
Package
Unit
Notes
0 (0)
100 (0.51)
200 (1.02)
Junction-to-ambient thermal resistance
without heat sink
θJA
θJA
E-PBGA
E-PBGA
20.0
18.7
11.9
17.9
°C/W
°C/W
Junction-to-ambient thermal resistance
with heat sink
15.3
10.5
Resistance Value
Junction-to-case thermal resistance
θJC
θJB
E-PBGA
E-PBGA
8.3
°C/W
°C/W
Junction-to-board thermal resistance
14.3
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
2. TA = TC - P×θCA, where TA is ambient temperature and P is power consumption.
3. TCMax = TJMax - P×θJC, where TJMax is maximum junction temperature (+125°C) and P is power consumption.
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved with a JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
Thermal Management
The following heat sinks were used in the above thermal analysis:
ALPHA W35-15W (35mm x 35mm x15mm)
ALPHA LPD35-15B (35mm x 35mm x15mm)
The heat sinks are manufactured by:
Alpha Novatech, Inc. (www.alphanovatech.com)
473 Sapena Court, #12
Santa Clara, CA 95054
Phone: 408-567-8082
Test Conditions
Output
Pin
Clock timing and switching characteristics are specified in accordance with operating
conditions shown in the table “Recommended DC Operating Conditions.” AC
50pF
specifications are characterized with V = 1.5V, T = +125°C and a 50pF test load as
DD
J
shown in the figure to the right.
66
AMCC Proprietary
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
