Revision 2.00 – December 2, 2004
405GPr – Power PC 405GPr Embedded Processor
Data Sheet
35mm, 456-Ball E-PBGA Package
Reserved Area for Ejector Pin Mark x 4 TYP
Corner Shape is Chamferred or Rounded
Top View
Gold Gate Release
Corresponds to
A1 Ball Location
30.0 Typ
C
Notes: 1. All dimensions are in mm.
2. This package is available in leaded or lead-free configurations.
C
0.20
0.20
A
C
0.25
35.0
0.35
C
31.75
Bottom View
AF
AD
AB
Y
1.27
AE
AC
AA
W
U
Mold
Compound
V
Thermal Balls
T
R
P
35.0
N
PCB
Substrate
M
K
H
F
L
J
G
E
D
B
C
A
B
1
3
5
7
9 11 13 15 17 19 21 23 25
8 10
26
24
0.6±0.1
2.65 max
6
12 14
16 18
4
22
2
20
0.75 ± 0.15 SOLDERBALL x 456
M
∅ 0.30 C A B
M
∅ 0.15
C
AMCC
15
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
