Revision 2.00 – December 2, 2004
405GPr – Power PC 405GPr Embedded Processor
Data Sheet
27mm, 456-Ball E-PBGA Package
Reserved Area for Ejector Pin Mark x 4 TYP
Top View
Corner Shape is Chamferred or Rounded
Gold Gate Release
Corresponds to
A1 Ball Location
24 TYP
2. This package is available in
leaded or lead-free configurations.
C
Notes: 1. All dimensions are in mm.
2. This package is available in leaded or lead-free configurations.
C
0.20
0.20
A
C
0.25
27.0
0.35
C
25.0
Bottom View
AF
AE
AD
AC
AB
AA
Y
1.0 TYP
Mold
Compound
W
V
Thermal Balls
U
T
R
P
27.0
N
L
PCB
Substrate
M
K
H
F
J
G
E
C
A
D
B
B
1
3
5
7
9 11 13 15 17 19 21 23 25
8 10
26
24
0.5±0.1
2.65 max
6
12 14
16 18
4
22
2
20
0.60 ± 0.1 SOLDERBALL x 456
M
∅ 0.30 C A
B
M
∅ 0.10
C
14
AMCC
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
