Thermal Resistance
43
Table 43.
Thermal Resistance of Excalibur Embedded Processor Solutions
Device
EPXA1
Package
FBGA
FBGA, Flip Chip (Cu lid)
FBGA, Flip Chip (AlSiC lid)
FBGA, Flip Chip (Cu lid)
EPXA4
FBGA, Flip Chip (AlSiC lid)
FBGA, Flip Chip (Cu lid)
FBGA, Flip Chip (AlSiC lid)
EPXA10
FBGA, Flip Chip (Cu lid)
FBGA, Flip Chip (AlSiC lid)
Pin
Count
484
672
672
672
672
1,020
1,020
1,020
1,020
JC
(° C/W)
4.0
0.5
0.8
0.2
0.3
0.2
0.3
0.1
0.2
JA
(° C/W)
Still Air
20.0
11.3
12.2
10.8
11.6
9.9
10.4
9.6
10.0
JA
(° C/W)
100 ft./min.
18.3
9.3
10.2
8.8
9.6
7.9
8.5
7.6
8.0
JA
(° C/W)
200 ft./min.
15.8
7.9
8.6
7.3
7.9
6.5
6.9
6.2
6.4
JA
(° C/W)
400 ft./min.
13.9
6.7
7.2
6.2
6.6
5.4
5.7
5.1
5.7
© December 2011
Altera Corporation
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