Device and Package Cross Reference
21
Table 21.
FLEX 10KE Devices (Part 3 of 3)
Device
TQFP, Wire Bond
EPF6016
PQFP, Wire Bond
PQFP, Wire Bond
BGA, Wire Bond, Option 2
TQFP, Wire Bond
FBGA, Wire Bond
EPF6016A
TQFP, Wire Bond
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
PQFP, Wire Bond
EPF6024A
PQFP, Wire Bond
BGA, Wire Bond, Option 2
FBGA, Wire Bond, Option 1
EPF8282A
EPF8452A
PLCC, Wire Bond
TQFP, Wire Bond
TQFP, Wire Bond
PQFP, Wire Bond
Package
Pins
144
208
240
256
100
100
144
208
256
144
208
240
256
256
84
100
100
160
Excalibur Devices
lists the device name, package type, and number of pins for the Excalibur
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 22.
Excalibur Devices
Device
EPXA1
EPXA4
EPXA10
Package
FBGA, Wire Bond, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Pins
484
672
672
1020
1020
© December 2011
Altera Corporation
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