Introduction
Table 1–2 shows MAX II device speed-grade offerings.
Table 1–2. MAX II Speed Grades
Speed Grade
Device
–3
–4
–5
–6
–7
EPM240
EPM240G
—
—
v
v
v
EPM570
EPM570G
—
—
—
—
—
—
v
v
v
v
v
v
v
v
v
EPM1270
EPM1270G
EPM2210
EPM2210G
EPM240Z
EPM570Z
—
—
—
—
—
—
v
v
v
v
MAX II devices are available in space-saving FineLine BGA, Micro
FineLine BGA, and thin quad flat pack (TQFP) packages (refer to
Tables 1–3 and 1–4). MAX II devices support vertical migration within the
same package (for example, you can migrate between the EPM570,
EPM1270, and EPM2210 devices in the 256-pin FineLine BGA package).
Vertical migration means that you can migrate to devices whose
dedicated pins and JTAG pins are the same and power pins are subsets or
supersets for a given package across device densities. The largest density
in any package has the highest number of power pins; you must lay out
for the largest planned density in a package to provide the necessary
power pins for migration. For I/O pin migration across densities, cross
reference the available I/O pins using the device pin-outs for all planned
densities of a given package type to identify which I/O pins can be
migrated. The Quartus® II software can automatically cross-reference and
place all pins for you when given a device migration list.
Altera Corporation
December 2007
1–3
MAX II Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
