1–12
Chapter 1: Cyclone III Device Family Overview
Reference and Ordering Information
Reference and Ordering Information
and
show the ordering codes for Cyclone III and Cyclone III LS
devices.
Figure 1–1. Cyclone III Device Packaging Ordering Information
Package Type
E : Plastic Enhanced Quad Flat Pack (EQFP)
Q : Plastic Quad Flat Pack (PQFP)
F : FineLine Ball-Grid Array (FBGA)
U : Ultra FineLine Ball-Grid Array (UBGA)
M : Micro FineLine Ball-Grid Array (MBGA)
Operating Temperature
C : Commercial temperature (T
J
= 0° C to 85° C)
I : Industrial temperature (T
J
= -40° C to 100° C)
A : Automotive temperature (T
J
= -40° C to 125° C)
Family Signature
EP3C : Cyclone III
EP3C
Member Code
5 : 5,136 logic elements
10 : 10,320 logic elements
16 : 15,408 logic elements
25 : 24,624 logic elements
25E : 24,624 logic elements
40 : 39,600 logic elements
55 : 55,856 logic elements
80 : 81,264 logic elements
120 : 119,088 logic elements
25
F
324
C
7
N
Optional Suffix
Indicates specific device
options or shipment method
N : Lead-free packaging
ES : Engineering sample
Speed Grade
6 (fastest)
7
8
Package Code
144 : 144 pins
164 : 164 pins
240 : 240 pins
256 : 256 pins
324 : 324 pins
484 : 484 pins
780 : 780 pins
Figure 1–2. Cyclone III LS Device Packaging Ordering Information
Package Type
F : FineLine Ball-Grid Array (FBGA)
U : Ultra FineLine Ball-Grid Array (UBGA)
Operating Temperature
C : Commercial temperature (T
J
= 0° C to 85° C)
I : Industrial temperature (T
J
= -40° C to 100° C)
Family Signature
EP3CLS : Cyclone III LS
EP3CLS
Member Code
70 : 70,208 logic elements
100 : 100,448 logic elements
150 : 150,848 logic elements
200 : 198,464 logic elements
70
F
484
C
7
N
Optional Suffix
Indicates specific device
options or shipment method
N : Lead-free packaging
ES : Engineering sample
Speed Grade
7 (fastest)
8
Package Code
484 : 484 pins
780 : 780 pins
July 2012 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
