Contents
Embedded Multipliers ........................................................................................................................
Multiplier Modes ............................................................................................................................
Embedded Multiplier Routing Interface .....................................................................................
I/O Structure & Features ....................................................................................................................
External Memory Interfacing .......................................................................................................
Programmable Drive Strength .....................................................................................................
Open-Drain Output ........................................................................................................................
Slew Rate Control ...........................................................................................................................
Bus Hold ..........................................................................................................................................
Programmable Pull-Up Resistor ..................................................................................................
Advanced I/O Standard Support ................................................................................................
High-Speed Differential Interfaces ..............................................................................................
Series On-Chip Termination .........................................................................................................
I/O Banks ........................................................................................................................................
MultiVolt I/O Interface .................................................................................................................
2–32
2–35
2–36
2–37
2–44
2–49
Chapter 3. Configuration & Testing
IEEE Std. 1149.1 (JTAG) Boundary Scan Support .............................................................................
Configuration .........................................................................................................................................
Operating Modes ...................................................................................................................................
Configuration Schemes .........................................................................................................................
Cyclone II Automated Single Event Upset Detection ......................................................................
Custom-Built Circuitry ....................................................................................................................
Software Interface .............................................................................................................................
Document Revision History .................................................................................................................
3–7
Chapter 4. Hot Socketing & Power-On Reset
Introduction ............................................................................................................................................
Cyclone II Hot-Socketing Specifications ............................................................................................
Devices Can Be Driven before Power-Up .....................................................................................
I/O Pins Remain Tri-Stated during Power-Up ............................................................................
Hot-Socketing Feature Implementation in Cyclone II Devices .......................................................
Power-On Reset Circuitry ....................................................................................................................
"Wake-up" Time for Cyclone II Devices .......................................................................................
Conclusion ..............................................................................................................................................
Document Revision History .................................................................................................................
4–3
Chapter 5. DC Characteristics and Timing Specifications
Operating Conditions ........................................................................................................................... 5–1
Single-Ended I/O Standards .......................................................................................................... 5–5
Differential I/O Standards .............................................................................................................. 5–7
DC Characteristics for Different Pin Types ..................................................................................... 5–11
On-Chip Termination Specifications ........................................................................................... 5–12
Power Consumption ........................................................................................................................... 5–13
Timing Specifications .......................................................................................................................... 5–14
Preliminary and Final Timing Specifications ............................................................................. 5–14
Performance .................................................................................................................................... 5–15
iv
Cyclone II Device Handbook, Volume 1
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