Package Information Datasheet for Mature Altera Devices
99
356-Pin Ball-Grid Array (BGA)—Wire Bond
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All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Specification
Ordering Code Reference
Package Acronym
Substrate Material
Solder Ball Composition
B
BGA
BT or tape
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MO-192 Variation: BAR-2
0.008 inches (0.20mm)
7.7 g (Typ.)
JEDEC Outline Reference
Lead Coplanarity
Weight
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min.
Nom.
—
Max.
1.70
—
A
A1
A2
D
—
0.35
0.25
—
—
1.10
35.00 BSC
35.00 BSC
0.75
E
b
0.60
0.90
e
1.27 BSC
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
ALTERA [ ALTERA CORPORATION ]
