Package Information Datasheet for Mature Altera Devices
97
324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Option 1
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Specification
Ordering Code Reference
Package Acronym
Substrate Material
Solder Ball Composition
F
FBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MS-034 Variation: AAG-1
0.008 inches (0.20mm)
1.4 g (Typ.)
JEDEC Outline Reference
Lead Coplanarity
Weight
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min.
Nom.
—
Max.
2.20
—
A
A1
A2
A3
D
—
0.30
—
—
—
1.80
0.70 REF
19.00 BSC
19.00 BSC
0.60
E
b
0.50
0.70
e
1.00 BSC
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
ALTERA [ ALTERA CORPORATION ]
