Package Information Datasheet for Mature Altera Devices
Thermal Resistance
43
Table 43. Thermal Resistance of Excalibur Embedded Processor Solutions
Pin
JA (° C/W)
JA (° C/W)
JA (° C/W)
JA (° C/W)
Device
Package
Count JC (° C/W)
Still Air
20.0
11.3
12.2
10.8
11.6
9.9
100 ft./min. 200 ft./min. 400 ft./min.
FBGA
484
672
4.0
0.5
0.8
0.2
0.3
0.2
0.3
0.1
0.2
18.3
9.3
10.2
8.8
9.6
7.9
8.5
7.6
8.0
15.8
7.9
8.6
7.3
7.9
6.5
6.9
6.2
6.4
13.9
6.7
7.2
6.2
6.6
5.4
5.7
5.1
5.7
EPXA1
FBGA, Flip Chip (Cu lid)
FBGA, Flip Chip (AlSiC lid)
FBGA, Flip Chip (Cu lid)
FBGA, Flip Chip (AlSiC lid)
FBGA, Flip Chip (Cu lid)
FBGA, Flip Chip (AlSiC lid)
FBGA, Flip Chip (Cu lid)
FBGA, Flip Chip (AlSiC lid)
672
672
672
EPXA4
1,020
1,020
1,020
1,020
10.4
9.6
EPXA10
10.0
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
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