38
Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 3 of 3)
Pin
JA (° C/W)
JA (° C/W)
JA (° C/W)
JA (° C/W)
Device
Package
BGA (Cu lid)
BGA (AlSiC lid)
FBGA
Count
JC (° C/W)
0.1
Still Air
100 ft./min.
200 ft./min.
400 ft./min.
8.2
9.2
9.2
4.0
9.6
10.1
5.0
6.9
7.3
7.3
3.0
7.6
8.1
3.0
5.5
5.8
5.8
2.5
6.2
6.4
2.5
4.4
4.8
4.8
2.0
5.1
5.3
2.0
652
0.2
652
652
0.1
EP20K1500E
Note to Table 37:
FBGA w/ fin (1)
FBGA (Cu lid)
FBGA (AlSiC lid)
FBGA w/ fin (1)
0.5
0.1
1,020
1,020
0.2
0.5
(1) “fin” is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera
performed the thermal calculations in Table 37 using the following fin specifications: width: 0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base
thickness: 0.5 mm.
ACEX 1K Devices Thermal Resistance
Table 38 provides thermal resistance values for ACEX 1K devices.
Table 38. Thermal Resistance of ACEX 1K Devices
Pin
JA (° C/W)
JA (° C/W)
JA (° C/W)
JA (° C/W)
Device
Package
TQFP
TQFP
PQFP
FBGA
TQFP
PQFP
FBGA
TQFP
PQFP
FBGA
FBGA
PQFP
FBGA
FBGA
Count
JC (° C/W)
11.0
8.0
Still Air
100 ft./min.
200 ft./min.
400 ft./min.
100
144
208
256
144
208
256
144
208
256
484
208
256
484
37.0
31.0
30.0
37.0
28.0
30.0
31.0
26.0
29.0
30.0
25.0
28.0
28.0
24.0
35.0
29.0
29.0
35.0
27.0
28.0
29.0
25.0
28.0
28.0
24.0
26.0
26.0
23.0
33.0
28.0
27.0
33.0
26.0
26.0
28.0
24.0
25.0
27.0
23.0
23.0
25.0
22.0
29.0
25.0
22.0
30.0
24.0
21.0
25.0
23.0
20.0
24.0
22.0
18.0
23.0
21.0
EP1K10
6.0
12.0
8.0
EP1K30
EP1K50
EP1K100
5.0
9.0
7.0
5.0
7.0
5.0
5.0
6.0
5.0
Package Information Datasheet for Mature Altera Devices
© December 2011 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
