34
Package Information Datasheet for Mature Altera Devices
Thermal Resistance
HardCopy II Devices
Table 34 lists the thermal resistance of HardCopy II devices.
Table 34. Thermal Resistance of HardCopy II Devices
JA (° C/W) JA (° C/W) JA (° C/W)
JA (° C/W)
Device
Package
Pin Count
JC (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min. JB (° C/W)
FBGA,
Wire Bond
HC210
484
5.5
21.3
17.4
9.9
9.5
8.6
8.4
7.5
15.3
8.3
8.0
7.1
6.9
6.1
13.8
7.1
6.8
6.0
5.8
5.0
9.6
3.6
3.5
2.9
2.7
2.6
FBGA,
Flip Chip
672
780
0.5
0.5
0.3
0.2
0.2
12.1
11.7
10.8
10.6
9.7
HC220
HC230
HC240
FBGA,
Flip Chip
FBGA,
Flip Chip
1020
1020
1508
FBGA,
Flip Chip
FBGA,
Flip Chip
HardCopy Devices
Table 35 lists the thermal resistance of HardCopy devices.
Table 35. Thermal Resistance of HardCopy Devices
Pin
JA (° C/W)
JA (° C/W)
JA (° C/W)
JA (° C/W)
Device
Package
Count
JC (° C/W)
0.5
Still Air
100 ft./min.
200 ft./min.
400 ft./min.
HC20K400
HC20K600
BGA, Flip Chip
FBGA, Flip Chip
FBGA, Wire Bond
BGA, Wire Bond
FBGA, Flip Chip
FBGA, Flip Chip
FBGA, Flip Chip
FBGA, Flip Chip
652
9.1
7.9
10.2
15.8
15.6
8.8
6.4
8.6
5.3
7.3
672
1.0
13.0
19.7
19.3
10.9
10.9
10.3
10.3
3.7
13.9
13.8
7.4
12.4
12.3
6.3
HC1S25
672
3.4
HC1S30
HC1S40
HC1S60
HC1S80
780
780
0.4
0.4
8.8
7.4
6.3
1020
1020
0.3
8.54
8.54
7.0
5.8
0.3
7.0
5.8
Package Information Datasheet for Mature Altera Devices
© December 2011 Altera Corporation
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