Expansion Interfaces
The DSP Development Kit, Stratix II Edition includes a heat sink and fan
combination, also known as an active heat sink. This active heat sink
maintains the Stratix II device within its thermal operating range,
independent of the design size, clock frequency, and operating
conditions, allowing you to evaluate larger high-speed designs in
hardware before completing the thermal analysis of your system.
Depending on the specific requirements of your application, this level of
cooling may not be necessary.
Install the Active
Heat Sink
f
For further information, refer to Application Note 355: Stratix II Device
System Power Considerations.
To mount the active heat sink to the board, perform the following steps:
1. Center the heat sink on top of the Stratix II FPGA. The active heat
sink can be mounted in two directions; mount it so the wires are as
close as possible to the J36 connector. When connected, these wires
supply the 5 V DC power to the fan.
2. Tilt the heat sink as shown in Figure 14, and attach the clip under
the FPGA.
Figure 14. Tilt the Heat Sink
Altera Corporation
49
Preliminary
ALTERA [ ALTERA CORPORATION ]
