1–4
Chapter 1: Cyclone III Device Family Overview
Cyclone III Device Family Features
Table 1–2 lists Cyclone III device family package options, I/O pins, and differential
channel counts.
(1), (2), (3), (4), (5)
Table 1–2. Cyclone III Device Family Package Options, I/O pin and Differential Channel Counts
(7)
Family
Package E144
M164
P240
—
F256
U256
F324
—
F484
—
U484
—
F780
—
EP3C5
EP3C10
94, 22 106, 28
94, 22 106, 28
182, 68 182, 68
182, 68 182, 68
—
—
—
—
—
EP3C16
84, 19 92, 23 160, 47 168, 55 168, 55
—
346, 140 346, 140
—
EP3C25
82, 18
—
—
—
—
—
—
—
—
—
—
148, 43 156, 54 156, 54 215, 83
—
—
—
Cyclone III
(8)
EP3C40
128, 26
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
195, 61 331, 127 331, 127 535, 227 (6)
EP3C55
—
—
—
—
—
—
—
—
327, 135 327, 135
295, 113 295, 113
377, 163
429, 181
531, 233
429, 181
429, 181
429, 181
429, 181
EP3C80
—
—
EP3C120
EP3CLS70
EP3CLS100
EP3CLS150
EP3CLS200
—
—
283, 106
—
—
—
294, 113 294, 113
294, 113 294, 113
—
—
Cyclone III
LS
—
—
226, 87
226, 87
—
—
—
—
Notes to Table 1–2:
(1) For each device package, the first number indicates the number of the I/O pin; the second number indicates the differential channel count.
(2) For more information about device packaging specifications, refer to the Cyclone III Package and Thermal Resistance webpage.
(3) The I/O pin numbers are the maximum I/O counts (including clock input pins) supported by the device package combination and can be affected
by the configuration scheme selected for the device.
(4) All packages are available in lead-free and leaded options.
(5) Vertical migration is not supported between Cyclone III and Cyclone III LS devices.
(6) The EP3C40 device in the F780 package supports restricted vertical migration. Maximum user I/Os are restricted to 510 I/Os if you enable
migration to the EP3C120 and are using voltage referenced I/O standards. If you are not using voltage referenced I/O standards, you can increase
the maximum number of I/Os.
(7) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground
plane on your PCB. Use this exposed pad for electrical connectivity and not for thermal purposes.
(8) All Cyclone III device UBGA packages are supported by the Quartus II software version 7.1 SP1 and later, with the exception of the UBGA
packages of EP3C16, which are supported by the Quartus II software version 7.2.
Cyclone III Device Handbook
Volume 1
July 2012 Altera Corporation