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CLK12P 参数 Datasheet PDF下载

CLK12P图片预览
型号: CLK12P
PDF下载: 下载PDF文件 查看货源
内容描述: 的Stratix II器件手册,卷1 [Stratix II Device Handbook, Volume 1]
分类和应用:
文件页数/大小: 768 页 / 5210 K
品牌: ALTERA [ ALTERA CORPORATION ]
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4. Hot Socketing &  
Power-On Reset  
SII51004-3.2  
Stratix® II devices offer hot socketing, which is also known as hot plug-in  
or hot swap, and power sequencing support without the use of any  
external devices. You can insert or remove a Stratix II board in a system  
during system operation without causing undesirable effects to the  
running system bus or the board that was inserted into the system.  
The hot socketing feature also removes some of the difficulty when you  
use Stratix II devices on printed circuit boards (PCBs) that also contain a  
mixture of 5.0-, 3.3-, 2.5-, 1.8-, 1.5- and 1.2-V devices. With the Stratix II hot  
socketing feature, you no longer need to ensure a proper power-up  
sequence for each device on the board.  
The Stratix II hot socketing feature provides:  
Board or device insertion and removal without external components  
or board manipulation  
Support for any power-up sequence  
Non-intrusive I/O buffers to system buses during hot insertion  
This chapter also discusses the power-on reset (POR) circuitry in Stratix II  
devices. The POR circuitry keeps the devices in the reset state until the  
VCC is within operating range.  
Stratix II devices offer hot socketing capability with all three features  
listed above without any external components or special design  
requirements. The hot socketing feature in Stratix II devices allows:  
Stratix II  
Hot-Socketing  
Specifications  
The device can be driven before power-up without any damage to  
the device itself.  
I/O pins remain tri-stated during power-up. The device does not  
drive out before or during power-up, thereby affecting other buses in  
operation.  
Signal pins do not drive the VCCIO, VCCPD, or VCCINT power supplies.  
External input signals to I/O pins of the device do not internally  
power the VCCIO or VCCINT power supplies of the device via internal  
paths within the device.  
Altera Corporation  
May 2007  
4–1