AS4LC4M4F1
®
Absolute maximum ratings
Parameter
Symbol
Vin
Min
Max
Unit
V
Input voltage
-1.0
-1.0
-1.0
-55
–
4.6
4.6
4.6
150
Input voltage (DQs)
VDQ
VCC
V
Power supply voltage
Storage temperature (plastic)
Soldering temperature × time
Power dissipation
V
TSTG
TSOLDER
PD
°C
oC × sec
260 × 10
0.432
50
–
W
Short circuit output current
Iout
–
mA
DC electrical characteristics
-50
-60
Parameter
Symbol Test conditions
Min Max Min Max Unit Notes
0V ≤ Vin ≤ +Vcc(max)
Input leakage current
IIL
-5
+5
+5
-5
-5
–
+5
+5
µA
µA
Pins not under test = 0V
Output leakage current IOL
DOUT disabled, 0V ≤ Vout ≤ + Vcc(max) -5
Operating power
ICC1
CAS, Address cycling; tRC=min
RAS = CAS ≥ VIH
–
–
120
110
mA
1,2
supply current
TTL standby power
ICC2
2.0
–
–
2.0
mA
mA
supply current
Average power supply
current, RAS refresh
mode or CBR
RAS cycling, CAS ≥ VIH,
ICC3
–
120
110
1
t
RC = min of RAS low after CAS low.
Fast page mode average
power supply current
RAS = VIL, CAS,
address cycling: tHPC = min
ICC4
ICC5
–
–
90
–
–
80
mA
mA
1, 2
CMOS standby power
supply current
RAS = CAS = VCC - 0.2V
2.0
2.0
VOH
VOL
IOUT = -2.0 mA
IOUT = 2.0 mA
2.4
–
–
2.4
–
–
V
V
Output voltage
0.4
0.4
CAS before RAS refresh
current
ICC6
RAS, CAS cycling, tRC = min
–
120
–
110
mA
RAS = CAS ≤ 0.2v,
Self refresh current
ICC7
WE - OE ≥ VCC - 0.2V,
-
0.6
-
0.6
mA
all other inputs at 0.2V or VCC - 0.2V
5/16/01; v.1.0 Restored
Alliance Semiconductor
P. 3 of 14
ALSC [ ALLIANCE SEMICONDUCTOR CORPORATION ]
