A3967
Selection Guide
Part Number
A3967SLBTR-T
Microstepping Driver with Translator
Packing
24-pin SOIC with internally fused pins
Package
1000 per reel
Absolute Maximum Ratings
Characteristic
Load Supply Voltage
Logic Supply Voltage
Logic Input Voltage Range
Sense Voltage
Reference Voltage
Output Current
Package Power Dissipation
Operating Ambient Temperature
Maximum Junction Temperature
Storage Temperature
Symbol
V
BB
V
CC
V
IN
V
SENSE
V
REF
I
OUT
P
D
T
A
T
J
(max)
T
stg
Output current rating may be limited by duty cycle, am-
bient temperature, and heat sinking. Under any set of
conditions, do not exceed the specified current rating
or a junction temperature of 150°C.
See graph
Range S
Fault conditions that produce excessive junction temperature will activate
the device’s thermal shutdown circuitry. These conditions can be toler-
ated but should be avoided.
Continuous
Peak
t
w
> 30 ns
t
w
< 30 ns
Notes
Rating
30
7.0
–0.3 to 7.0
–1 to 7.0
0.68
V
CC
±750
±850
–
–20 to 85
150
–55 to 150
Units
V
V
V
V
V
mA
mA
mA
–
ºC
ºC
ºC
Thermal Characteristics
Characteristic
Package Thermal Resistance, Junction
to Ambient
Symbol
R
θJA
Test Conditions*
2
2-layer PCB, 1.3 in. 2-oz. exposed copper
Value
50
35
Units
ºC/W
ºC/W
4-layer PCB, based on JEDEC standard
*Additional thermal information available on Allegro website.
ALLOWABLE PACKAGE POWER DISSIPATION (W)
5
R
JT
= 6.0 C/W
4
3
R
JA
= 35°C/W
2
R
JA
= 50°C/W
1
0
25
50
75
100
TEMPERATURE IN C
125
150
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2